As the carrier of various components and the hub of circuit signal transmission PCB has become the most important and key part of electronic information products, its quality and reliability level determines the quality and reliability of the whole machine equipment, due to the development trend of PCB high density and lead-free and halohalogen free environmental requirements, More and more PCBS have various failure problems such as poor wetting, burst board, delamination, CAF and so on. The acquisition of PCB failure mechanism and causes will be conducive to the quality control of PCB in the future, so as to avoid the recurrence of similar problems.
PTTS failure Analysis Laboratory has an experienced and skilled service team, a variety of advanced testing and analysis instruments, to provide customers with efficient, accurate and fair testing and analysis services.
PCB product failure analysis:
1. Foaming and layering of the plate surface;
2. Welding resistance film falls off;
3. The board is black;
4. Migration, oxidation corrosion
5. Open and short circuits
PCBA lead-free solder joint reliability test:
Appearance inspection | Infrared microscope analysis | Acoustic scanning analysis | temperature shock |
microsection | X-ray fluoroscopic examination | Strength (tensile, shear) | temperature cycle |
SEM/EDS | Computer chromatographic analysis | Tin ball thrust | hot and humid |
drop test | random vibration | ambient temperature and moisture | hot and humid |
temperature cycle | SEM examine | Dyeing test | plating thickness |
Tin ball tension test (mainly for BGA tin ball, Cable, etc.) | |||
PCB testing items mainly include:
Mechanical properties of PCB | Thermal properties of PCB | PCB reliability testing | PCB electrical performance test |
1. visual inspection | 1. heat conductivity coefficient | 1. Cleanliness (ion contamination) test | 1. withstand voltage |
2. dimensional measurement | 2. thermal resistance | 2. hygroscopicity | 2. insulation resistance test |
3. Micro size detection | 3. coefficient of thermal expansion | 3. Copper clad laminate test | 3. Moisture resistance and insulation resistance |
4. Hole size measurement | 4. Thermogravimetric temperature | 4. salt spray test | 4. Surface/volume resistivity |
5. Hole metal coating dimension measurement | 5. Explosion time T260/T288 | 5. Multi-layer printed circuit board mechanical impact | 5. Thermal cycling test metallized hole resistance changes |
6. Lateral/concave erosion | 6. Thermal cracking temperature Td | 6. Rigid printed line resistant to vibration | |
7. flexural strength test | 7. thermal stress | 7. Rigid printed board thermal shock | |
8. Bending strength of rigid insulating laminates | 8. Flame retardant test (plastic, PCB substrate) | 8. Heat resistant oil | |
9. Peel strength test (copper-clad sheet, PCB) | 9. Weldability test | 9. mould test | |
10. Copper foil elongation | 10. Thermal stress test of plating through holes (plating holes) | 10. thermal stress | |
11. Coating adhesion | 11. GTT(glass-transition temperature) | 11. steam aging | |
12. Porosity of coating | 12. weldability test | ||
13. Warpage test | |||
14. tensile strength test Bonding strength, bonding strength, vertical pull test of surface assembly pad for connecting disc with hole of non-supporting element |
