Introduction to X-ray fluoroscopy
1. X-ray fluoroscopy is a method to detect internal defects of the sample according to the X-ray absorption rate and transmission rate of different parts of the sample, using the X-ray intensity after attenuation through various parts of the sample. The attenuation degree of X-ray is related to the material variety, thickness and density of the sample. The X-ray intensity of the material decreases exponentially with the X-ray absorption coefficient and thickness of the material, and the internal structure and defects of the material correspond to X-ray images with different grayness and blackness.
2. The X-ray fluoroscope has a resolution of 0.25 microns, and can achieve 360° horizontal rotation of the dorsal object and ±45° Z-direction adjustment. 3D X-ray inspection can realize 2D section and 3D stereogram, avoid image overlap and confuse the phenomenon of real defects, can clearly show the internal structure of the object to be measured, and improve the ability to identify the internal defects of the object.
3. X-ray perspective is generally used to detect the internal structure of electronic components and printed circuit boards, internal lead open or short circuit, bonding defects, solder joint defects, package cracks, holes, Bridges, stelae and device leakage and other defects; At the same time, it can detect the internal structure and defects of connectors, electronic integrators, cables, fittings, plastic parts, aluminum castings, etc.
About X-RAY Perspective Testing:
definition: | X-RAY fluoroscopy, that is, through X-ray non-destructive fluoroscopy to check the internal structure of the sample or solder joint. |
test purpose： | Without destroying the sample, check the cracks, disconnections, voids, bubbles, delamination and other defects inside the sample or solder joint. |
Applicable product range: | Printed circuit boards PCB and PCBA, semiconductor packages and connectors, electronic integrators, sensors, microelectronic systems and |
test philosophy: | The instrument generates X-rays to illuminate the sample, which pass through the sample to the receiving end and are imitated by a computer. Different structures inside the sample absorb or pass through X-rays, and engineers look for defects by looking at the light and dark changes in the image. |
reference standard: | For PCB, PCBA, BGA, SMT solder joint inspection, according to IPC-A-610D judgment. Cables, plastic parts and other fluoroscopic inspection disconnect, crack, bubble tests are usually judged according to customer requirements. |
