Objective: Surface and internal defect inspection of electronic components and SMT process improvement & verification.
Scope of application: It is suitable for structural analysis of electronic components, PCBA welding defects, tin form and defect detection on solder joints.
Instruments used: precision cutting machine, embedding machine, grinding and polishing machine, metallographic microscope, electron microscope, etc.
Test process: sampling -- embedding -- grinding -- polishing -- corrosion -- observation and photography
Routine inspection standard: IPC-TM650-2.1.1/2.25 IPC-A-610D
Sample type:
1. PCB structural defects: PCB layering, hole copper fracture, etc.;
2. PCBA welding quality inspection:
a. BGA air welding, virtual welding, hole, bridge, tin area, etc.;
b. Product structure analysis: capacitor and PCB copper foil layer analysis, LED structure analysis, plating process analysis, internal structural defects of materials, etc.;
c. Micro size measurement (generally greater than 1um): pore size, tin height, copper foil thickness, etc.
