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Failure analysis and testing of electronic components Mechanical testing of materials

Failure analysis and detection of electronic components


Failure analysis plays an important role in ensuring and improving the reliability and quality of products, and it is necessary to introduce failure analysis in the development, production and use of products. As an important part of PTTS one-stop service, PTTS failure Analysis Laboratory has an experienced and skilled service team, and a variety of advanced testing and analysis instruments, which can provide customers with efficient, accurate and fair testing and analysis services.

The significance of electronic components testing:

1. Component factory: obtain the basis for improving product design and process;

2. The whole machine factory: the basis for obtaining claims, changing component suppliers, improving circuit design, improving circuit board manufacturing process, improving test technology, and designing protection circuits;

3. Machine users: obtain the basis for improving the operating environment and operating procedures, improve product yield and reliability, establish a corporate image, and improve product competitiveness.


Extended application of failure analysis technology:


1. The role of purchase analysis: select high-quality supply channels to prevent counterfeit and shoddy components from entering the machine production line;

2. The role of good product analysis: a shortcut to learn advanced technology.


Process suitability evaluation of electronic components:

1. Reflux sensitivity test according to standard J-STD 020, including temperature and humidity treatment and reflow welding;

2. Weldability test;

3. Metal layer solubility test;

4. Welding heat test.

Routine testing of electronic components:

 

 1. break or open a seal

 17. Lead bonding strength

 2. Grain extraction

 18. Chip bond strength

 3. Chip level removal

 19. backside grinding

 4. Remove gold bulges

 20. TEM

 5. dye

 21. EELS

 6. High resolution microphotography

 22. AFM

 7. BGA(PCB)&IC Circuit mapping service

 23. C-AFM

 8. Scanning electron microscopy

 24. SIMS

 9. High/low order made fixed point cross section cutting

 25. TOF-SIM

 10. EMMILC Liquid crystal hot spot detection

 26. AES

 11. OBIRCH use

 27. XPS

 12. Electrostatic discharge (ESD) test

 28. XRD

 13. Probe application

 29. STEM

 14. LCR use

 30. Fib-line repair

 15. I-V curve measurement

 31. X-ray fluoroscopy

 16. laser cutting

 32. Ultrasonic Scanning Examination (C-SAM)

 


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