Failure analysis and detection of electronic components
Failure analysis plays an important role in ensuring and improving the reliability and quality of products, and it is necessary to introduce failure analysis in the development, production and use of products. As an important part of PTTS one-stop service, PTTS failure Analysis Laboratory has an experienced and skilled service team, and a variety of advanced testing and analysis instruments, which can provide customers with efficient, accurate and fair testing and analysis services.
The significance of electronic components testing:
1. Component factory: obtain the basis for improving product design and process;
2. The whole machine factory: the basis for obtaining claims, changing component suppliers, improving circuit design, improving circuit board manufacturing process, improving test technology, and designing protection circuits;
3. Machine users: obtain the basis for improving the operating environment and operating procedures, improve product yield and reliability, establish a corporate image, and improve product competitiveness.
Extended application of failure analysis technology:
1. The role of purchase analysis: select high-quality supply channels to prevent counterfeit and shoddy components from entering the machine production line;
2. The role of good product analysis: a shortcut to learn advanced technology.
Process suitability evaluation of electronic components:
1. Reflux sensitivity test according to standard J-STD 020, including temperature and humidity treatment and reflow welding;
2. Weldability test;
3. Metal layer solubility test;
4. Welding heat test.
Routine testing of electronic components:
1. break or open a seal | 17. Lead bonding strength |
2. Grain extraction | 18. Chip bond strength |
3. Chip level removal | 19. backside grinding |
4. Remove gold bulges | 20. TEM |
5. dye | 21. EELS |
6. High resolution microphotography | 22. AFM |
7. BGA(PCB)&IC Circuit mapping service | 23. C-AFM |
8. Scanning electron microscopy | 24. SIMS |
9. High/low order made fixed point cross section cutting | 25. TOF-SIM |
10. EMMILC Liquid crystal hot spot detection | 26. AES |
11. OBIRCH use | 27. XPS |
12. Electrostatic discharge (ESD) test | 28. XRD |
13. Probe application | 29. STEM |
14. LCR use | 30. Fib-line repair |
15. I-V curve measurement | 31. X-ray fluoroscopy |
16. laser cutting | 32. Ultrasonic Scanning Examination (C-SAM) |